Domestic Rego connector: Can we independently develop high-frequency ports?

With the continuous rigid demand for high-bandwidth, low-latency interfaces in fields such as data centers, AI computing, 5G edge devices, and industrial communications, the independent controllability of high-frequency/high-speed ports (such as PCIe Gen4/Gen5, CFexpress, DisplayPort, etc.) has become a key direction for the domestication of the connector industry. This article takes the product characteristics of **Rego (Rego Electronics)** as a reference to explore whether and how domestic connectors can achieve the technical route and industrial supporting points of independently developed high-frequency ports.

Why choose Rego as the control object?

Rego is a manufacturer with a product line covering backplanes, Edge-Card, storage cards, I/O (Display/HDMI/USB) and high-power power connector, with products used in both consumer markets and widely entering industrial, server, and data communication scenarios. Its product portfolio well represents the design and application requirements of "high frequency + high reliability" connectors.

Part Two: Technical Characteristics of Rego (Reference Value for Domestic R&D)
1. High-speed edge/PCIe products support the design positioning of the next-generation bandwidth: Rego's Edge-Card/PCIe series is aimed at application scenarios that "support the next-generation processors and higher bandwidth" in the product specifications, which requires strict indicators to be achieved in differential pair arrangement, impedance control, shielding/grounding, and contact design. If domestic manufacturers want to independently develop high-frequency ports, they must first achieve repeatable process capabilities in these basic engineering aspects.
The CFexpress storage card and high durability design: Rego's CFexpress and storage card socket design, which takes into account high throughput, durability, and industrial-grade temperature range, is a typical representative of the mechanical and electrical comprehensive capabilities of miniaturized high-frequency interfaces. The domestic R&D needs to take into account both micro-structural mechanical design and the verification process of signal integrity.

The ability to mix power and signal (backplane power): In Rego's power/backplane product line, there are designs that can bear dozens of amperes with a single contact (some series can reach tens of amperes even up to 65A), which indicates that the self-developed high-frequency ports cannot only focus on signal - power transmission, heat dissipation, and mechanical bearing are also indispensable considerations in some applications. If domestic ports are to target high-end servers and communication equipment, they also need to have the ability in high current contact, thermal management, and modular design.

Three, the key technical challenges faced by domestically developed high-frequency ports
Based on the technical features of the above Rego, the difficulties of independently developed domestic products can be summarized into the following categories:
Material and electroplating process: High-frequency ports have extremely high requirements for contact coating, substrate resistivity, and interconnection surface roughness; the thickness of gold plating, nickel resistive layer, and contact life must be guaranteed by stable processes.
Miniaturized mechanical tolerances: High-density pin holes and edge structure put high specifications requirements on mold precision, tolerance control, and stress release of injection parts.
Signal integrity (SI) and electromagnetic compatibility (EMC) design capability: the internal differential pairs, return path, grounding loop, shielding structure, etc., need to be jointly simulated and verified with PCB/wire cable system.
● Thermal management and high current carrying: In the scenario of power and signal mixing, the thermal life of the solder joint/terminal, the system heat dissipation path, and the ability to resist thermal fatigue are very critical.
●Testing and verification system: From TDR, S-parameter, BER to insertion/extraction life, thermal cycle, salt mist, etc., domestic enterprises must establish a complete set of trustworthy experimental and acceptance procedures.

These challenges are not insurmountable, but require collaborative input from research and development, technology, testing, and the supply chain.

Four, industrial environment and favorable factors for domestic self-research and development
Despite the high threshold, localization also has realistic advantages and conditions to be utilized:
●Localized supply chain closer to customers: Compared with foreign brands, local manufacturers are usually more flexible in customization response, sample iteration, and after-sales support, which is conducive to shortening the product development cycle.
● Gradual localization of manufacturing and testing equipment: The localization rate of molds, automated assembly equipment, reflow/peak welding, and some high-precision testing equipment has increased, providing hardware support for the industry's expansion.
●Cost and Scale Advantages: After production capacity matures, domestic solutions can be more competitive in terms of cost, which is of great significance for large-scale replacement and industrial penetration.

These favorable conditions, combined with the aforementioned technological breakthroughs, can form the basis for "sustainable alternatives."

Five, suggested implementation path (combination of technology and business)
1. Phased advancement: Initially, focus on medium and low frequency/low impedance scenarios (such as industrial interfaces that are not Gen5 and have high requirements for insertion/extraction life and reliability), and gradually accumulate the design and SI simulation capabilities for high-frequency ports.
Establish a joint validation platform: Jointly set up a signal/thermal/mechanical whole-machine validation environment with mainboard, system manufacturers, and testing institutions to shorten the feedback cycle.
3. Material and process partnership construction: Establish long-term technical cooperation with coating and blade material suppliers, and carry out targeted material reliability tests.
Modularization and Configurable Design: The "signal + power module" design reduces the complexity of one-time R&D while meeting customized needs.

5. Quality and Batch Management: Establish SPC, FMEA, first article inspection, and release standards before transitioning from design to mass production to ensure consistency in batch performance.

The "high frequency, high density, high reliability" connectors represented by Rego are not an unattainable goal. With domestic connector enterprises continuously investing in technology, equipment, and supply chain, they have the conditions to achieve self-research of high-frequency ports at a stage. To truly achieve "from following to running in parallel, even leading", the key lies in: systematic material and process research, end-to-end signal/heat/mechanical joint verification capabilities, and in-depth cooperation with downstream system manufacturers. As long as the weaknesses are bridged and a quality system after mass production is genuinely established, the self-research of domestic high-frequency ports is achievable and has commercial value.
If you are interested in domestic substitutes for Rego brand connectors or have procurement needs, or if you have production or sales channels for these domestic substitutes and wish to engage in in-depth cooperation or communication, please contact us through the following methods:Manager Zhang (18665383950, same WeChat number)We look forward to working together with more industry partners.